Direct link to conference program

This year’s IEEE ESTC Conference will feature roughly 120 oral and 70 poster presentations highlighting new developments in advanced packaging, wafer-level packaging, reliability of electronic devices and power electronics, to name but a few topics. As in previous years, the conference papers will be published in the conference proceedings and in the IEEE Xplore database.

We are delighted to welcome four distinguished packaging experts as keynote speakers who will be presenting new findings from their respective areas of expertise.

Other highlights include four professional development courses on the morning of the first conference day, an EPS HIR Workshop, Special Sessions on ChipsAct and IPCEI project, Photonics and Quantum Computing, Education and Green ICT as well as a Panel Discussion on “Chiplet Architectures for Automotive“.

Please note that changes in the program may still occur.