IEEE ESTC 2024 Awards
Our congratulations go to the recipients of the IEEE ESTC Best Paper and Best Poster Awards, sponsored by ASE. The Awards Committee selected their contributions from the many excellent papers in a painstaking process.
Best Paper:
Superconducting Superlattice Interconnects for Cryogenic Systems
The paper outlines the development of highly thermally resistive interconnects for cryogenic integrated systems, based on the superconducting superlattice technology. Preliminary results show enhanced thermal resistance via phonon interface scattering while maintaining perfect electrical conduction at low temperatures.
Charles Bon-mardion1, Edouard Deschaseaux1, Thierry Farjot1, Alain Campo1, Frédéric Ritton1, Rémi Vélard1, Hélène Duchemin1, Céline Feautrier1, Jean-Luc Sauvageot2, Jean Charbonnier1, Candice Thomas1
Organization(s): 1: Univ. Grenoble Alpes, CEA, LETI, Grenoble, France; 2: Université Paris-Saclay, CEA, IRFU, Gif-sur-Yvette, France
Best Paper Award recipient Charles Bon-mardion with IEEE ESTC 2024 Program Chair Toni Mattila
Best Poster
Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications
The paper addresses packaging-related challenges in 3D compression molding technology, presenting a technological solution for the high precision alignment of pre-molded substrates for a second overmolding step. The work systematically compares four different approaches to increase alignment accuracy, evaluates the technological pros/cons also experimentally and provides experimental proof to the applicability of the high precision alignment solution found.
Nyake Gahein-Sama1, Marc Dreissigacker2, Friedrich Müller2, Christian Tschoban1, Tanja Braun1, Karl-Friedrich Becker1, Martin Schneider-Ramelow2
Organization(s): 1: Fraunhofer IZM, Berlin, Germany; 2: TU Berlin, Berlin, Germany
Best Poster Award recipient Nyake Gahein-Sama with IEEE ESTC 2024 General Chair Tanja Braun and Poster Chair Karl-Friedich Becker
IEEE EPS Regional Contribution Award
Region 8 (Europe, Middle East and Africa)
Christopher Bailey | Arizona State University, USA
For outstanding contribution to the success of multiple EPS conferences in the Region spanning over two decades, for active leadership and development of the EPS UK&RI Chapter.
IEEE EPS Regional Contribution Award recipient Chris Bailey with IEEE ESTC 2024 Program Chair Toni Mattila
Recipients of the IEEE EPS Student Travel Awards
Kaneeze Noorul Ain
Silicon Austria Labs (SAL), Villach, Austria &
Delft University of Technology (TUD), Delft, The Netherlands
An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®
Abinash Pradhan
Silicon Austria Labs GmbH, Austria
Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters
Andrei Costina
Fraunhofer IZM, Berlin, Germany
Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors
Charles Bon-mardion
Univ. Grenoble Alpes, CEA, LETI, Grenoble, France
Superconducting Superlattice Interconnects for Cryogenic Systems
Sarabjot Singh
University at Albany, State University of New York, New York, USA
Tuning of Copper Grain Size for Integration in Hybrid Bonding Applications
Weiyang Miao
Institute of Microelectronics (IME), Singapore, Republic of Singapore
Signal Integrity Optimization for CoWoS Chiplet Interconnection Design Assisted by Reinforcement Learning
Sheikh Rokibul Hassan
School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom
Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessments of Power Electronic Modules with Nonlinear Material Behaviours
Khalil Maarouf
Valeo Vision, France
Analysis of LED Solder Joints During Combined Power and Thermal Cycling
