Chiplets for Automotive:  Design, Package Options and Special Considerations

Thursday, September 12, 2024, 5:15 – 6:45pm

Moderators:
E. Jan Vardaman, TechSearch International, Inc.
Vikas Gupta, ASE

Software Defined Vehicles enabled by electric/electronic (E/E) and software architecture will play a vital role in automotive and semiconductor value chain. Automotive E/E architectures have evolved from decentralized approach to Zonal Controllers and Central Compute Units which drive Silicon consolidation and integration. Emerging designs bring together CPUs, memory and hardware accelerators based on advanced Silicon nodes. With the adoption of advanced semiconductor nodes, the automotive industry is facing challenges on how to maintain silicon cost.  The adoption of chiplet architectures is under investigation by several companies.  While chiplet adoption is expanding in many applications ranging from computing to consumer, automotive electronics is a special case with different reliability requirements and constraints.  Drivers for the adoption of chiplets will be discussed.  The panel discusses challenges such as design, package options, thermal, test and reliability requirements.  Examples of solutions for these challenges will be discussed.

Panel

• Christophe Gaudron, Global Procurement Director, Renault
• Kurt Herremans, Director Automotive Chiplet Program, imec
• Devan Iyer, Chief Strategist – Advanced Packaging, IPC International
• Thorsten Meyer, Senior Principal Package Concept Engineering, Infineon Technologies
• Khai Nguyen, Senior Principal Reliability Manager, Nvidia
• Michael Schiffer, Head of Department Wafer Level System Integration, Fraunhofer IZM
• Kathy Yan, Director, Advanced Packaging New Technology and System Integration, TSMC