The 10th IEEE ESTC
SEPTEMBER 11–13, 2024 | BERLIN, GERMANY
Event Sponsors
The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024)
The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. The 10th IEEE ESTC will be taking place in Berlin, Germany.
10th IEEE ESTC Conference – A Resounding Success!
IEEE ESTC 2024 Best Paper, Best Poster and Student Travel Awards
IEEE ESTC 2024 Keynotes
Three keynotes are now available for download.
A Vision for Modular, Ubiquitous & Scalable Compute Systems | Bernd Waidhas, Intel
CHIPS -NAPMP: Overview and Next Steps | George Orji, CHIPS NAPMP
IEEE ESTC 2024 Special Sessions
Presentations of the IEEE EPS Special Sessions are now available and can be downloaded.
HIR Special Session at ESTC 2024
Presentations of the IEEE EPS Heterogeneous Integration Roadmap Workshop are now available and can be viewed on the EPS website (link below):
Side Events
September 9-10, 2024, Berlin, Germany
3rd EuroPAT-Workshop “Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing?”
Organized by SEMI Europe, Hosted by Swissbit Germany AG
More Info
September 10, 2024, Berlin, Germany
Workshop “Direct Write Technology in Industrial R&D, Electronics System Integration, and Packaging”
Organized by Heidelberg Instruments and Fraunhofer IZM
More Info
Conference Program
This year’s IEEE ESTC Conference featured 120 oral and 50 poster presentations, 4 keynotes, 3 PDCs, an IEEE EPS HIR Workshop, 5 special sessions, and a panel on “Chiplet Architectures for Automotive”.
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